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EasyPACK™ 2B 1200 V, 120 A booster IGBT module with PressFIT contact technology and High Speed IGBT H3.

特征描述

• Low switching losses
• Fast silicon diode 1200 V
• Al₂O₃ substrate with low thermal resistance
• Integrated NTC temperature sensor
• PressFIT contact technology

优势

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility