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SEMiX205BT07F3SC4 Features

• Solderless assembling solution with PressFIT signal pins and screw power terminals
• IGBT 3 High Speed Trench Technology
• Silicon Carbide (SiC) Free-wheeling Schottky diodes : Diode 1 (D1…D4)
• Silicon anti-parallel diodes , Diode 2 (D5…D8)
• V_CE(sat) with positive temperature coefficient
• Low inductance case
• Reliable mechanical design with injection moulded terminals and reliable internal connections
• UL recognized file no. E63532
• NTC temperature sensor inside

SEMiX205BT07F3SC4 Target Applications

• High Frequency Resonant Converter
• Interleaved Active Rectifier
• UPS